Technology Technology
グループ工場にて実装および部品交換や
改造まで行います。
グループ一丸となり常に探求心を持って、
全員の知識と想像力でお客様のご要望に
お応えします。
詳しくは工場HPをご参照ください。
部品実装
For BGA, LGA, and parts where PAD is hidden directly under the package,
We will give you an X-ray image as a set, so you can check the soldering condition of the solder.
You can feel it for yourself.
Immediately dispatch a specialist to your company on the spot
We will replace parts and modify the board.
Time required 15 minutes ~
Approximate cost ¥ 500 ~ (Example) 2 to 3 SMD chips
Target parts Parts excluding ball shapes such as BGA and CSP
(In the case of pick-up, ball mounting is possible)
* Prices may fluctuate depending on the replacement location and difficulty level.
* Transportation fees may be incurred depending on the destination.
Please feel free to contact us by phone or email.
TEL 045-227-0788
MAIL info@luxres.jp
For customers with confidentiality agreements
Pick-up ⇒ Parts replacement ⇒ Delivery will be completed within the same day at the earliest.
In prototyping and evaluation board production, unexpected and sudden problems often occur.
Given that budget and time are limited, if we can manage it quickly, at the lowest possible cost, and while maintaining quality ...
Please help such customers.
[Board remodeling / repair]
Repair case
CASE1: I made a mistake in the circuit connection.
CASE2: The probe was hit too hard and the land or pattern came off.
CASE3: The LED (cathode ⇒ anode) connection is reversed, and the polarity of the component does not match the board PAD.
The printed circuit board needs to be handled with care, but although I was careful enough,
It is delicate and easily scratched by a slight impact even during transportation, debugging evaluation, repair, and collision.
Regarding the repair method, we will respond to the customer's request by making full use of the experience and technology cultivated so far.
Component mounting is the most important process that determines product quality.
We have set the standard for quick delivery because of high quality.
[Hand mounting by loose parts / tape cutting]
・ I want you to mount it based on the ribbon-cutting ceremony.
・ I want to reduce the surplus as much as possible due to budgetary reasons.
・ There will be many loose items
Even if it cannot be mounted by an automatic machine due to the customer's circumstances, we will handle it by hand mounting by personnel one by one.
Mounter mounting is possible even for tape-cut products if you keep the surplus number. We will always optimize the mounting method.
[Preventing schedule loss due to missing items]
We will promptly check the parts we have received and provide prompt feedback if there are any missing parts, so we can transfer them to the mounting process with plenty of time.
[Challenge to implement various high difficulty levels cultivated from an inquisitive mind]
As the momentum of thinning and shortening of semiconductors accelerates, new mounting issues with new products are occurring every day.
We are always inquisitive and will put all our employees' knowledge and creativity to meet the needs of our customers.
0402 chip size / 2000pin over BGA package / 0.3mm pitch BGA / CSP / 0.3mm pitch FMC connector etc.
Reflow board size Width 650mm x 700mm (MAX) / Thickness 8.0mm (MAX) / Thick copper / Aluminum board / FPC etc.
[Compatible with wire bonding / flip chip mounting]
We also accept wire bonding and flip chip mounting through tie-ups with partner companies.
By sharing design and mounting technology, we support a wide variety of mounting processes and high-precision mounting.
・ Chip On Board
(IC chip is mounted on the board with resin,
Circuit pattern and IC chip with gold wire
Technology to connect directly. COB)
The process order of COB and solder mounting is controlled by the board specifications and manufacturing quantity.
We perform consistent process control in all mounting processes.
[Parts replacement / rework]
It is no exaggeration to say that the essence of component mounting lies in solder.
That is why we are a group of craftsmen who are particular about soldering, do not allow themselves to compromise, and master soldering.
At our company, only technicians who have a good track record and skill are allowed to handle solder.
・ All the parts were not collected by the mounting process, so I had no choice but to proceed without mounting.
・ For some reason, the debug evaluation does not show the characteristics ... Isn't it a defect of the parts?
・ The parts have been damaged, but there is no time to deliver.
・ It is difficult to ask a specialist for one chip part ... Can you handle it?
・ I tried to replace the parts, but it failed, so I want to replace it again.
・ I tried to replace the parts, but it didn't look good anyway ...
Equipment list
・ Mounter YV-100XG (Yamaha), YG100RB (Yamaha)
・ N2 reflow furnace SNR-1065GT (Senju Metal)
・ Automatic printing machine SP60P-L (Panasonic)
・ Automatic soldering device BT-1-300Z (Meisho)
・ Pb-free DIP tank SPF400 (Senju Metal)
・ Spray Fraxer SSF-400 (Senju Metal)
・ Soldering iron WXP120 (Weller)
・ X-ray fluoroscopy inspection device S4090IN (Toshiba)
・ Board appearance inspection equipment M22XDL (Marantz), U22XF-650 (Marantz)
・ Board cutter Maestro 2M / T type (cab)
・ External supply device YTF-80W (Yamaha)
・ Nitrogen gas separator RN-22 (Kuraray Chemical)
・ High temperature tank HT220 (ETAC)
・ Rework device MS9000SAN (Meisho)