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コンピュータチュートリアル
Printed Board

　ラグレスが基板製造を手がけることで単なるファブレス思考ではなく、お客様にフィットした提案を形にしてお届けすることが可能です。


　必要とされる専門分野に狙いを限定し、良質と実績を兼ね揃えた基板製造メーカーとタッグを組むことで、どんなフェーズでも堅実にお答えしていきます。

基板製造

[ Specifications ]

▽ Minimum L / S

  • Outer layer 18 μm: 100/100 μm

  • Outer layer 12 μm: 80/80 μm (pad-on-via cannot be mixed)

  • Outer layer 35 μm: 150/150 μm

  • Outer layer 18 μm: 80/80 μm

  • Outer layer 70 μm: 250/250 μm

  • Outer layer 18 μm: 200/200 μm

* For pad-on-via specifications, a pad pitch of 0.4 mm / one wiring between vias is possible.

▽ Minimum pad / penetrating via diameter

  • 4-layer resin hole filling CSP pad φ0.22 (design value) Pitch 0.3 mm

  • Hole diameter φ0.1 mm Land diameter φ0.35 mm (depending on specifications)

▽ Number of manufacturing layers / thickness

  • Number of layers: Single-sided board Double-sided board Multi-layer board (3 to 30 layers)

  • Plate thickness: 0.1t-4.8t

▽ Surface treatment

  • Water-soluble heat-resistant flux

  • Solder leveler (eutectic lead-free, Sn / Ag / Cu type)

  • Gold plating (flash electroless bonding (thick) / electrolytic)

  • Terminal gold plating (electrolytic hard gold plating)

[Handling base material]

 

  ● Main general materials

・ FR-4 CEM3 High thermal conductivity CEM3

 

  ● High frequency support (low dielectric / low dielectric loss tangent)

・ R-5775 (MEGTRON6)

・ R-5785 (MEGTRON7)

  ・ FL700TypeLD  HK-950-SK (BT resin)

・ High frequency support (low dielectric / low dielectric loss tangent)

・ Fluororesin substrate (manufactured by various Rogers)

・ Teflon material

・ Laminating specifications (Teflon + FR-4, etc.)

　

 

  ● Equivalent to FR-5 (high heat resistance / high elasticity / low thermal expansion)

 

・ High-performance FR-4 BT resin

 

  ● Environmentally friendly materials

·halogen free

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  ● Ultra-thin / flexible multi-layer

・ Cute (epoxy type)

   ・ MCF-5000I (polyimide type)

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  * Please contact us for other base materials.

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